Table of contents
Calculation of PCB track impedance
Andrew J. Burkhardt, Christopher S. Gregg, J. Alan StaniforthThe value of the controlled impedance of various track configurations is usually obtained using algebraic equations. Most of these equations, particularly those for non‐zero track…
Laser (UV) microvia application in cellular technology
Sudhakar Raman, Jae Hun Jeong, Sang Jin Kim, Ben Sun, Keon‐Yang ParkIn the past three years, microvia drilling using laser technology has become the dominant method of producing blind vias smaller than 150μm. The ablation characteristics of the…
Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various glass transition temperature levels
Kathleen M. ReutzelA common method for understanding the thermal performance of epoxy laminate materials is to analyze the glass transition temperature using instruments such as differential…
FLINT ‐ fine line interconnect ‐ project: development of technologies for the production of HDI‐boards
Andreas Griesinger, Bernd GuentherIn September 1996 six leading European companies all involved in printed wiring board (PWB) manufacturing and electronic packaging decided to start a common development project…
Thermal reliability of high density interconnects utilizing microvias and standard through‐hole technologies
Todd Young, Mike Carano, Frank PolakovicAs high density interconnect (HDI) technologies become accepted in the printed circuit board (PCB) industry, build‐up multilayer (BUM) technologies utilizing laser ablated…
An accurate method for measuring the dielectric constant of printed wiring board materials
N.G. PaulterA new time‐domain reflectometry measurement method is described that provides accurate measurements of the average high‐frequency (0.1GHz ‐ 10GHz) dielectric constant of printed…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari