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Article
Publication date: 25 December 2023

Peng Ma, Qin Yuan and Henry Xu

Previous studies have rarely integrated the financing modes of a capital-constrained manufacturer with the choices of online sales strategies. To address this gap, the authors…

Abstract

Purpose

Previous studies have rarely integrated the financing modes of a capital-constrained manufacturer with the choices of online sales strategies. To address this gap, the authors study how a manufacturer selects optimal financing modes under different sales strategies in three dual-channel supply chains.

Design/methodology/approach

This paper considers three sales strategies, namely, combining a traditional retailer channel with one of the direct selling, reselling and agency selling channels, and two common financing modes, namely, bank financing and retailer financing. The authors obtain equilibrium outcomes of the manufacturer and traditional retailer and then provide the conditions for them to select optimal financing modes under three sales strategies.

Findings

The results indicate that the manufacturer’s financing decisions rely on the initial capital and interest rates, and the manufacturer selects retailer financing only if the initial capital is relatively larger. In terms of financing mode options, the retailer financing mode is more beneficial for the manufacturer under the three sales strategies. From the perspective of sales strategies, the direct selling model is more beneficial. In addition, the higher the consumer acceptance of the online channel, the more profits the manufacturer obtains.

Practical implications

This paper provides suggestions on how the capital-constrained manufacturer chooses financing modes and sales strategies.

Originality/value

This paper integrates the financing mode and different sales strategies to investigate the manufacturer’s optimal operational decisions. These sales strategies allow us to investigate the manufacturer’s optimal financing modes in the presence of both different financing modes and sales strategies.

Details

Kybernetes, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0368-492X

Keywords

Article
Publication date: 7 March 2023

Tian Huang, Guisheng Gan, Cong Liu, Peng Ma, Yongchong Ma, Zheng Tang, Dayong Cheng, Xin Liu and Kun Tian

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of…

Abstract

Purpose

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints.

Design/methodology/approach

A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength.

Findings

The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu5Zn8) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu5Zn8) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface.

Originality/value

The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

Details

Microelectronics International, vol. 40 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 28 March 2023

Peng Ma and Yujia Lu

Under the carbon tax policy, the authors examine the operational decisions of the low-carbon supply chain with the triple bottom line.

Abstract

Purpose

Under the carbon tax policy, the authors examine the operational decisions of the low-carbon supply chain with the triple bottom line.

Design/methodology/approach

This paper uses the Stackelberg game theory to obtain the optimal wholesale prices, retail prices, sales quantities and carbon emissions in different cases, and investigates the effect of the carbon tax policy.

Findings

This study’s main results are as follows: (1) the optimal retail price of the centralized supply chain is the lowest, while that of the decentralized supply chain where the manufacturer undertakes the carbon emission reduction (CER) responsibility and the corporate social responsibility (CSR) is the highest under certain conditions. (2) The sales quantity when the retailer undertakes the CER responsibility and the CSR is the largest. (3) The supply chain obtains the highest profits when the retailer undertakes the CER responsibility and the CSR. (4) The environmental performance impact decreases with the carbon tax.

Practical implications

The results of this study can provide decision-making suggestions for low-carbon supply chains. Besides, this paper provides implications for the government to promote the low-carbon market.

Originality/value

Most of the existing studies only consider economic responsibility and social responsibility or only consider economic responsibility and environmental responsibility. This paper is the first study that examines the operational decisions of low-carbon supply chains with the triple bottom line under the carbon tax policy.

Details

Kybernetes, vol. 53 no. 5
Type: Research Article
ISSN: 0368-492X

Keywords

Article
Publication date: 30 September 2022

Guisheng Gan, Shiqi Chen, Liujie Jiang, Cong Liu, Tian Huang, Peng Ma, Dayong Cheng and Xin Liu

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

Abstract

Purpose

This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted.

Design/methodology/approach

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature.

Findings

The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu6Sn5 to wavy-shaped Cu5Zn8. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles.

Originality/value

A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.

Details

Soldering & Surface Mount Technology, vol. 35 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 26 August 2022

Guisheng Gan, Shiqi Chen, Liujie Jiang, Zhaoqi Jiang, Cong Liu, Peng Ma, Dayong Cheng and Xin Liu

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.

Abstract

Purpose

This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Cu joints.

Design/methodology/approach

A new method that 1 um Zn-particles and Sn-0.3Ag-0.7Cu (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched.

Findings

The composition of the intermetallic compounds (IMCs) on the upper and lower interfaces of Cu/SACZ/Cu joints remained unchanged, which was Cu5Zn8 in aging process, and the thickness of the IMCs on the upper and lower interfaces of the Cu/SACZ/Cu joints increased accordingly. Compared with the as-received joints, the thickness of the upper and lower interfaces IMCs of the soldering aged time for 24 h increased by 404.7% and 505.5% at 150ºC, respectively. The IMCs formation tendency and the IMCs growth rate of the lower interface are larger than those of the upper interface because the soldering seam near the IMCs at the upper and lower interfaces of the as-received joints were mostly white SAC0307 balls black Zn-particles, respectively. The growth activation energy of IMCs in the upper and lower interfaces is about 89.21 and 55.11 kJ/mol, respectively. Under the same aging time, with the increase of the aging temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than that of the as-received joints because the oxidation degree of Zn particles in the joint with the increase of aging temperature and time.

Originality/value

Cu/Cu joints were successfully achieved under ultrasonic-assisted at low-temperature.

Details

Soldering & Surface Mount Technology, vol. 35 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 24 January 2023

Guisheng Gan, Shi-qi Chen, Liujie Jiang, Cong Liu, Peng Ma, Tian Huang, Dayong Cheng and Xin Liu

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

85

Abstract

Purpose

This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted.

Design/methodology/approach

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the joint and successfully achieved micro-joining of Cu/Al under ultrasonic-assisted.

Findings

The results indicated that when the bonding temperature was 180°C, there was only one layer of CuZn5 intermetallic compounds (IMCs) at the Cu interface. However, when the bonding temperature was 190°C, 200°C and 210°C, the Cu interface IMCs had two layers: for one layer, the IMCs near the Cu substrate were Cu5Zn8 and for another layer, the IMCs near the solder were CuZn5. In addition, the thickness of the Cu interfacial IMCs increased with the bonding temperature. In particular, the thickness of IMCs at the Cu interface of the Cu/Al joints soldered at 210°C was 4.6 µm, which increased by 139.6% compared with that of the Cu/Al joints soldered at 180°C. However, there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature was 200°C, the shear strength of the Cu/Al joints reached the maximum of 38.07 MPa, which was 153.6% higher than that at 180°C. When the soldering temperature was 180°C, the fracture of Cu/Al joints was mainly on the Al side. However, when soldering temperature was 190°C, 200°C and 210°C, the fracture of Cu/Al joints was mainly broken in the Zn particles layer.

Originality/value

A new method that 1 mm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 mm were mixed to fill the Cu/Al joint at 210°C.

Details

Soldering & Surface Mount Technology, vol. 35 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 13 June 2023

Xiaogen Liu, Shuang Qi, Detian Wan and Dezhi Zheng

This paper aims to analyze the bearing characteristics of the high speed train window glass under aerodynamic load effects.

Abstract

Purpose

This paper aims to analyze the bearing characteristics of the high speed train window glass under aerodynamic load effects.

Design/methodology/approach

In order to obtain the dynamic strain response of passenger compartment window glass during high-speed train crossing the tunnel, taking the passenger compartment window glass of the CRH3 high speed train on Wuhan–Guangzhou High Speed Railway as the research object, this study tests the strain dynamic response and maximum principal stress of the high speed train passing through the tunnel entrance and exit, the tunnel and tunnel groups as well as trains meeting in the tunnel at an average speed of 300 km·h-1.

Findings

The results show that while crossing the tunnel, the passenger compartment window glass of high speed train is subjected to the alternating action of positive and negative air pressures, which shows the typical mechanic characteristics of the alternating fatigue stress of positive-negative transient strain. The maximum principal stress of passenger compartment window glass for high speed train caused by tunnel aerodynamic effects does not exceed 5 MPa, and the maximum value occurs at the corresponding time of crossing the tunnel groups. The high speed train window glass bears medium and low strain rates under the action of tunnel aerodynamic effects, while the maximum strain rate occurs at the meeting moment when the window glass meets the train head approaching from the opposite side in the tunnel. The shear modulus of laminated glass PVB film that makes up high speed train window glass is sensitive to the temperature and action time. The dynamically equivalent thickness and stiffness of the laminated glass and the dynamic bearing capacity of the window glass decrease with the increase of the action time under tunnel aerodynamic pressure. Thus, the influence of the loading action time and fatigue under tunnel aerodynamic effects on the glass strength should be considered in the design for the bearing performance of high speed train window glass.

Originality/value

The research results provide data support for the analysis of mechanical characteristics, damage mechanism, strength design and structural optimization of high speed train glass.

Abstract

Details

Globalization, Political Economy, Business and Society in Pandemic Times
Type: Book
ISBN: 978-1-80071-792-3

Article
Publication date: 7 September 2020

Carry Mak, Robin Stanley Snell and Jacky Hong

The purpose of this paper is to investigate Peter Senge’s ideas from the perspective of the spiritual ideal of harmony/He (和).

Abstract

Purpose

The purpose of this paper is to investigate Peter Senge’s ideas from the perspective of the spiritual ideal of harmony/He (和).

Design/methodology/approach

Following a literature review of the conceptualization of Senge’s fifth discipline and harmony, an appreciative case study of Alibaba is adopted to demonstrate the role of harmony in guiding the transformative application of the five disciplines of the learning organization.

Findings

In developing as a learning organization, Alibaba is portrayed as having embraced three levels of harmony: person-within-oneself, person-to-others and person-to-nature harmony. The authors identify three equivalencies between Senge’s disciplines and the traditional Chinese ideal of harmony. First, personal mastery and metal models correspond to developing person-within-oneself harmony. Second, team learning and shared vision entail developing person-to-others harmony. Third, systems thinking aligns with person-to-nature harmony.

Practical implications

The case study demonstrates various approaches that can be used to foster the development of person-within-oneself, person-to-others and person-to-nature harmony within an aspiring learning organization.

Originality/value

This paper shows how core values of Confucianism, Taoism and Buddhism, distilled into the Chinese ideal of harmony, can encourage the cultivation of learning organizations.

Details

The Learning Organization, vol. 27 no. 6
Type: Research Article
ISSN: 0969-6474

Keywords

Article
Publication date: 6 February 2017

Shanshan Zhang, Zhiqiang Wang, Xiande Zhao and Min Zhang

The purpose of this paper is to empirically investigate the effects of institutional support on product and process innovation and firm performance and describe how dysfunctional…

1188

Abstract

Purpose

The purpose of this paper is to empirically investigate the effects of institutional support on product and process innovation and firm performance and describe how dysfunctional competition influences relevant outcomes.

Design/methodology/approach

This study develops a research model based on institution-based view and tests it using structural equation modeling and empirical data collected from 300 manufacturers in China.

Findings

The results show that institutional support positively affects product and process innovation and firm performance. Both product and process innovation improve firm performance. The findings reveal that dysfunctional competition significantly reduces the positive effects of institutional support on product and process innovation but leaves the effects of institutional support and product and process innovation on firm performance unaffected.

Originality/value

This study contributes to innovation literature by providing insights into the impact of China’s institutional environment on manufacturing firms’ product and process innovation decisions. The findings also contribute to institution-based view literature by providing empirical evidence on the joint effects of institutional support and dysfunctional competition on product and process innovation and firm performance. This study can help manufacturers in China take advantage of institutional environment and adjust product and process innovation decisions accordingly.

Details

Industrial Management & Data Systems, vol. 117 no. 1
Type: Research Article
ISSN: 0263-5577

Keywords

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