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The current paper is aimed to explore the relationship between virtuous leadership (VL) dimensions and the dimensions of innovation management (IM) among employees in pharmaceutical companies of the public business sector – Egypt.

The current paper relied on the descriptive and analytical method and the survey paper in dealing with the paper variables. Participants for this paper consisted of (312) employees who completed a questionnaire that assessed VL and IM.

The results revealed that there is a positive, statistically significant relationship between VL and IM, Specifically, there is a positive effect of courage, justice and prudence on strategic innovation, a positive effect of courage, humanity and asceticism on technical innovation, and there is a positive effect of prudence, humanity and courage on management innovation.

The paper concluded that VL acts as an important tool that facilitates IM and promotes high levels of innovation for employees.

The current paper contributed to understanding the conditions in which employees of pharmaceutical companies have VL and provided additional guidance for effective practices of quality IM in pharmaceutical companies of the public business sector. In this study, a model was built to analyze the mechanism underlying the relationship between virtuous leadership and innovation management in pharmaceutical companies.

The purpose of this paper is to examine how the spiritual leadership (SL) of the leader is perceived by workers in the public health sector in the Assiut region of Egypt. In other words, this study investigates the work-related workplace spirituality (WPS) of public health workers in this context.

An online survey was conducted among a sample of 333 employees working in the public health sector in Assiut.

The empirical results indicate that the SL of the leader (especially altruism and vision), as evaluated by employees, positively influence work-related WPS. The results confirm that strengthening SL is a promising pathway to improve WPS, which may ultimately have some benefits, such as helping to improve individual and institutional performance in the public health sector.

The authors hope that the theoretical insights gained through the findings of this study will encourage researchers to explore how and when to enhance SL and WPS for employees.

This paper aims to bring these areas closer by exploring the relationship between the dimensions of strategic intelligence (SI) for leadership and the proactive work behaviours (PWBs) of Upper Egypt universities' employees. Therefore, the research question revolves around: is there a relationship between SI and PWB?

The study relied on a descriptive analytical approach and a stratified random sample. The paper opts for a descriptive study using the survey lists that depends on three scales: strategic leadership intelligence. The sampling unit is represented by the individuals working in Upper Egypt Universities, distributed on a sample of 364 Upper Egypt universities' employees.

The results indicate a significant relationship between dimensions of SI for leadership and the PWBs.

Because of the chosen research approach, the research results may lack generalisability. Therefore, researchers are encouraged to test the proposed propositions further. This paper is the first to examine, to the authors' knowledge the relationship between intelligence for leadership and the PWBs.

Applicable to telecom companies operating in Saudi Arabia, this study aims to investigate the mediating role of workplace dignity (WD) in the relationship between inclusive leadership and innovative work behavior (IWB) as well as the moderate role of workplace inclusion (WI) in said relationship.

A total of 364 telecom companies in Saudi Arabia participated in the survey study. SmartPLS was employed to evaluate the data and test the research variables.

According to this study, inclusive leadership has a favorable impact on IWB. Additionally, the study concluded that inclusive leadership enhances WD. Furthermore, the authors discovered that WD has a favorable impact on IWB. The findings showed that the association between inclusive leadership and IWB is mediated by WD. Finally, WI has a statistically positive moderating effect between WD and IWB on the moderation side of the analysis.

This study is the first to consider WD as a mediator in the relationship between inclusive leadership and IWB. Examining WI's role as a moderator also deepens the authors' comprehension of the connection between WD and IWB.

This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy.

Ternary melt-spun Sn-Ag-Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry.

The results revealed that the Ag₃Sn intermetallic compound (IMC) and ß-Sn have been refined because of the hard inclusions’ (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn_96.4-Ag_3.5-Cr_0.1 alloy showed an improvement in Young’s modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic Sn-Ag alloy due to the high concentration of Ag₃Sn and their uniform distribution. Shortage in the internal friction (Q⁻¹) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag₃Sn formation led to low toughness values compared to the eutectic Sn-Ag alloy, which may have resulted from the mismatching among hexagonal Ag₃Sn phase with orthorhombic Ag₃Sn and ß-Sn phases. Mechanically, the values of Young’s modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn_95.8-Ag_3.5-Cr_0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 × 10⁻⁴) compared to the other alloys. Increase in the melting temperature T_m, ΔH, C_p and ΔT was because of Ag₃Sn IMC formation. The low toughness of Sn₉₆-Ag_3.5-Cr_0.5 and Sn_95.8-Ag_3.5-Cr_0.7 (109.56 J/m³ and 35.66 J/m³), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m⁻¹.k⁻¹ and 0.314 m²/s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with “0.1 Wt.%” of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly.

This study provides chromium effects on the structure of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.

This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep resistance by adding different concentrations of Ni content.

Ternary melt-spun Sn-Ag-Ni alloys were investigated using x-ray diffractions, scanning electron microscope, dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and differential scanning calorimetry.

The results revealed that the Ni additions 0.1, 0.3, 0.5, 0.7, 1, 3 and 5 Wt.% to the eutectic Sn-Ag melt-spun solder were added. The “0.3wt.%” of Ni was significantly improved its mechanical properties to efficiently serve under high strain rate applications. Moreover, the uniform distribution of Ag₃Sn intermetallic compound with “0.3wt.%” of Ni offered the potential benefits, such as high strength, good plasticity consequently and good mechanical performance through a lack of dislocations and microvoids. The tensile results showed improvement in 17.63 per cent tensile strength (26 MPa), 21 per cent toughness (1001 J/m³), 22.83 per cent critical shear stress (25.074 MPa) and 11 per cent thermal diffusivity (2.065 × 10⁻⁷ m²/s) when compared with the tensile strength (21.416 MPa), toughness (790 J/m³), critical shear stress (19.348 MPa) and thermal diffusivity (1.487 × 10⁻⁷ m²/s) of the eutectic Sn-Ag. Slight increments have been shown for the melting temperature of Sn_96.2-Ag_3.5-Ni_0.3 (222.62°C) and electrical resistivity to (1.612 × 10⁻⁷ Ω.m). It can be said that the eutectic Sn-Ag solder alloy has been mechanically improved with “0.3wt.%” of Ni to become a suitable alloy for high strain rate applications. The dislocation movement deformation mechanism (n = 4.5) without Ni additions changed to grain boundary sliding deformation mechanism (n = 3.5) with Ni additions. On the other hand, the elastic modulus, creep rate and strain rate sensitivity with “0.3wt.%” of Ni have been decreased. The optimum Ni-doped concentration is “0.7wt.%” of Ni in terms of refined microstructure, electrical resistivity, Young’s Modulus, bulk modulus, shear modulus, thermal diffusivity, maximum shear stress, tensile strength and average creep rate.

This study provides nickel effects on the structural of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors have compared the elastic modulus of the melt-spun compositions which has been resulted from the tensile strength tester with these results from the DRT for the first time to best of the authors’ knowledge. This paper presents new improvements in mechanical and electrical performance.