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In the context of the “year‐2000” problem, focuses on the risk involved in real time clocks and their interactions with associated embedded processors and logic arrays, dedicated electronic control and monitoring logic incorporated into larger systems. These are essential to the operation of a vast portfolio of infrastructures, from medical equipment, to buildings (phone, security, heating, plumbing and lighting), to transportation, to financial networks, to just‐in‐time delivery systems, and so on. According to a recent study, the firmware (permanently loaded instructions) that enables these systems to run is date sensitive and not year‐2000‐compliant in less than 1 percent of the 50 billion microprocessors and microcontrollers used in embedded systems installed worldwide by the end of the twentieth century. This small fraction will fail, causing the systems they control to begin failing around 1 January 2000 and for the first few years of the next century. Presents a pessimistic, illustrative scenario, describing the disruption of essential infrastructure from electric power, to food and fuel distribution, to communications, to financial networks.

Embedded systems are at the heart of most electronic devices and machines. Embedded systems are added to other products to make those products “smarter”, easier to use, or to add unique features. These systems are generally encoded with permanent instructions that cannot be easily changed, if at all. Problems can arise in embedded systems dealing with the representation of dates before, during, and after the year 2000. As a result, equipment or products that include embedded systems may malfunction, cause data to be corrupted, or stop working entirely. This paper defines a process that an organization would be able to utilize to find embedded systems, verify if they are Year 2000 compliant, and remediate if necessary

Presents an embedded MAS (Multi‐Agent System) based control method for multi link series manipulators.

The manipulator's completing operation work is based on several agents' cooperation. The entire embedded MAS of a manipulator is implemented in one ARM7 microprocessor. The multi agents and the communications between the agents are constructed depending on the real‐time multitasking capability and the system services of real time operation system, μC/OS‐(tm). An improved distributed inverse kinematics algorithm, which is the foundation the agents' behavior strategies, and the system architecture designing are described in detail.

This method is very suitable for tele‐operation redundant manipulators' embedded control systems designing, with high reliability.

Using this paradigm, the embedded system firmware development for a redundant manipulator would be very easy and the code would be reusable. A few amendments should be made for miscellaneous manipulators.

It is suitable for controlling a high reliability expected tele‐operation manipulator system.

The embedded MAS based manipulator control paradigm has several attractive advantages, led from MAS theory. Basing this method, we do not require computing the traditional inverse (or pseudoinverse) Jacobian matrix to control a redundant manipulator, especially for mobile redundant robot based on a compact embedded control system, expecting high reliability and potential complexity for coping with dynamical environments. The development procedure would be very easy and the code would be reusable. A few amendments should be made for different manipulators.

In management texts, management and control of operations is handled through the establishment of models and budgets of various kinds. Takes a broader view of operations. Follows this by consideration of modes of control for networks. Then considers financial control and clan control issues in embedded networks or chains of operations. In the first section develops some of the characteristics of the embedded firm. Follows this by a discussion of the problem of control in and out of chains of embedded firms. Examines the issues for financial control. Finally explores the social and organizational processes within and between partners in such chains.

Acknowledges the potential problems the year 2000 may cause to computer software and hardware, but emphasises the need to understand fully and acknowledge the challenges and threats posed by date sensitive embedded systems. Describes embedded systems and the reasons why they have been generally ignored in the discussions about the year 2000. Discusses the potential disasters and the efforts that need to be made to overcome these problems. Provides examples of problems that have already been considered or encountered.

Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers, and several critical defence devices. Market pressures for new products with more features, smaller size and lower cost demand smaller, compacter, simpler substrates. An obvious strategy is to reduce the number of surface mounted passives by embedding them in the substrate. In addition, current interconnect technology to accommodate surface mounted passives imposes certain limits on board design which constrain the overall system speed. Embedding passives is one way to minimize the functional footprint while at the same time improving performance. The purpose of this paper is to describe the development of a thin film technology based on ferroelectric‐epoxy polymer‐based flake‐free resin coated copper capacitive (RC3) nanocomposites to manufacture multilayer embedded capacitors.

This paper discusses thin film technology based on RC3 nanocomposites. In particular, recent developments in high capacitance, large area, thin film passives, and their integration in system in a package (SiP) are highlighted.

A variety of RC3 nanocomposite thin films ranging from 8 to 50 microns thick were processed on copper substrates by liquid coating. Multilayer embedded capacitors resulted in high capacitances of 16‐28 nF. The fabricated test vehicle also included two embedded resistor layers with resistances in the range of 15 Ω to 100 kΩ. To enable high performance devices, an embedded resistor must meet certain tolerances. The embedded resistors can be laser trimmed to a tolerance of <5 percent, which is usually acceptable for most applications. An extended embedded passives solution has been demonstrated, both through its high wireability designs and package performance, to be perfectly suited for SiP applications.

This case study designed and fabricated an eight layer high density internal passive core and subsequently applied fine geometry three buildup layers to form a 3‐8‐3 structure. The passive core technology is capable of providing up to six layers of embedded capacitance and could be extended further.

A thin film technology based on ferroelectric‐epoxy polymer‐based flake‐free RC3 nanocomposites was developed to manufacture multilayer embedded capacitors. The overall approach lends itself to package miniaturization because capacitance can be increased through multiple layers and reduced thickness to give the desired values in a smaller area.

The purpose of this paper is to present a hybrid manufacturing system that integrates stereolithography (SL) and direct print (DP) technologies to fabricate three‐dimensional (3D) structures with embedded electronic circuits. A detailed process was developed that enables fabrication of monolithic 3D packages with electronics without removal from the hybrid SL/DP machine during the process. Successful devices are demonstrated consisting of simple 555 timer circuits designed and fabricated in 2D (single layer of routing) and 3D (multiple layers of routing and component placement).

A hybrid SL/DP system was designed and developed using a 3D Systems SL 250/50 machine and an nScrypt micro‐dispensing pump integrated within the SL machine through orthogonally‐aligned linear translation stages. A corresponding manufacturing process was also developed using this system to fabricate 2D and 3D monolithic structures with embedded electronic circuits. The process involved part design, process planning, integrated manufacturing (including multiple starts and stops of both SL and DP and multiple intermediate processes), and post‐processing. SL provided substrate/mechanical structure manufacturing while interconnections were achieved using DP of conductive inks. Simple functional demonstrations involving 2D and 3D circuit designs were accomplished.

The 3D micro‐dispensing DP system provided control over conductive trace deposition and combined with the manufacturing flexibility of the SL machine enabled the fabrication of monolithic 3D electronic structures. To fabricate a 3D electronic device within the hybrid SL/DP machine, a process was developed that required multiple starts and stops of the SL process, removal of uncured resin from the SL substrate, insertion of active and passive electronic components, and DP and laser curing of the conductive traces. Using this process, the hybrid SL/DP technology was capable of successfully fabricating, without removal from the machine during fabrication, functional 2D and 3D 555 timer circuits packaged within SL substrates.

Results indicated that fabrication of 3D embedded electronic systems is possible using the hybrid SL/DP machine. A complete manufacturing process was developed to fabricate complex, monolithic 3D structures with electronics in a single set‐up, advancing the capabilities of additive manufacturing (AM) technologies. Although the process does not require removal of the structure from the machine during fabrication, many of the current sub‐processes are manual. As a result, further research and development on automation and optimization of many of the sub‐processes are required to enhance the overall manufacturing process.

A new methodology is presented for manufacturing non‐traditional electronic systems in arbitrary form, while achieving miniaturization and enabling rugged structure. Advanced applications are demonstrated using a semi‐automated approach to SL/DP integration. Opportunities exist to fully automate the hybrid SL/DP machine and optimize the manufacturing process for enhancing the commercial appeal for fabricating complex systems.

This work broadly demonstrates what can be achieved by integrating multiple AM technologies together for fabricating unique devices and more specifically demonstrates a hybrid SL/DP machine that can produce 3D monolithic structures with embedded electronics and printed interconnects.

The purpose of this paper is to contribute to a better understanding of how socially‐embedded information systems (IS), knowledge, and firm capabilities can impact the post‐merger integration efforts of a firm. In particular, this research seeks to identify, describe, and analyze how socially‐embedded resources hindered the integration of the procurement function following the merger of two telecommunications firms.

This research was designed as a longitudinal exploratory study of a single case. The design involved multiple interviews, participant observation, and an evaluation of multiple data sources. Data were collected to develop a comprehensive and reliable understanding of events and outcomes related to the systems integration effort. Process models are used to show the development of phenomena over time.

The findings of the research are twofold. First, in line with previous findings on socially‐embedded resources, the research shows that socially‐embedded resources hindered the ability of a merged firm to integrate some resources. Previous research argued that social constraints can prevent a firm from changing the way it uses resources to establish a competitive advantage, and this research confirms those findings. Second, this research is an important contribution because it identifies two social constraints in particular – cognitive sunk costs and the reluctance to defy social traditions – that contributed to the inability of the merged firm to successfully integrate the procurement function following a merger.

The findings of this study provide empirical evidence to support the theoretical argument that the socially embedded resources involved in the IS, knowledge, and firm capabilities of each of the firms prior to the merger enabled them to establish a competitive advantage in their respective market environments. Further, the data provide validation for the idea that the social context in which firms compete does, in fact, contribute to the development of competitive advantages. The RBV is also extended by showing that the same social contexts can also prevent firms from integrating important resources following a corporate merger.

One of the main objectives of executive management following a corporate merger is to lead the organization in skillfully integrating key resources of the merged organization. However, most firms cannot successfully engage in post‐merger integration efforts unless they fully understand how resources such as IS, knowledge, and firm capabilities can help or hinder their integration efforts. By highlighting one firm's efforts to integrate resources following a merger, the paper provides concrete examples of potential problems that can arise. Potential problems and hindrances are presented in a strategic checklist for managerial consideration.

This paper discusses the year 2000 problem. After briefly introducing why there is a problem the paper investigates its origins and consequences. Key to resolving the problem of compliance is the need to define what compliance means; this issue is touched on. Attention is then given to the problem of embedded systems and how they are affected by the year 2000 problem. As many avionics applications are supported by such systems this is an important and relevant topic. The paper then goes on to identify potential avionics applications that may be impacted by the problem. The last part of the paper briefly discusses how the problem may be addressed and resolved.

Students of organizations are beginning to recognize the importance of continuous learning in organizations, but to date the concept is not well understood, particularly in terms of how the learning of individuals is related to the learning that takes place in groups, which is related to the learning that occurs in organizations (and all other combinations). To further our understanding, we offer the idea of continuous learning in organizations from a living system's perspective. We view individuals, groups, and organizations as living systems nested in a hierarchy. We propose that living systems can learn in three ways: they can adapt, they can generate, and they can transform. Learning triggers from the environment spark learning, and this relationship is moderated by the system's readiness to learn. Readiness to learn is a function of the permeability of the system's boundaries, the system's stage of development, and the system's meta-systems perspective. Additional research questions are presented to explore learning flow between levels and to determine how the match between one system's pressure for change and another system's readiness to learn affects the emergence of adaptive, generative, and transformative learning. In addition, research questions are offered as a means to test these ideas and build grounded theory. Finally, using this model, the chapter presents three case studies and suggests diagnostic questions to analyze and facilitate continuous learning from a multi-level perspective.